Electroless Copper Plating Process

CIRCUM-BRITE™ M-10 Electroless Copper Plating Process

– Low temperature and low speed.
– Specially designed for printed circuit board through-hole plating process.
– Able to form a pure, smooth, delicate and even copper layer.
– Can form a 20 µin (0.5µm) copper deposit in 10-20 min.
– Possess various advantages such as high stability, easy to maintanence, easy to operate, long lifespan and low wastewater treatment cost.