Copper Plating Process

MIS BG-1 MIS Acid Copper Plating Process for Semiconductor

– Able to form a ductile, smooth, and anti-splitting semi-bright copper deposit.
– Easy operation; can achieve up to 70 ASF (10 ASD) when applying to circuit board plating.

MIS BG-2 MIS Acid Copper Plating Process for Semiconductor

– Able to form a ductile, smooth, and anti-splitting semi-bright copper deposit.
– Easy operation; can achieve up to 100 ASF (10 ASD) when applying to circuit board plating.

CIRCUM-BRITE™ 2000 Acid Copper Plating Process

– Possess excellent levelling power even for through-hole plating.
– Able to maintain operating conditions within: current density of 1-5 A/dm2, temperature in 20-30 °C and copper concentration in 60-90 g/L.
– Great brightness; absense of stress in deposit and thus applicable to Thermal Cycling Test.
– The bath will not affected by decompoition products.
– Carbon treatment only needed after a long period of through-hole plating.

CIRCUM-BRITE™ 3011 Acid Copper Plating Process

– Specially designed for PCB products of high aspect ratio.
– High stability; Low organic additive contents
– High ratio of copper and free acid and thus strengthen the throwing power.
– Able to form a fine-grained, even and semi-bright deposit with good ductility.

MIS VP-1 Blind Via Hole Copper Plating Process

– Additive system for multi-structure conformal plating and through-hole plating.
Suitable for general vertical plating and vertical continual plating (VCP) production line.
– Able to form a bright and fine layer with good ductility and excellent physical properties

MIS VF-1 Blind Via Hole Acid Copper Plating Process

– Additive system for multi-structure conformal plating and through-hole plating.
– Able to form a bright and fine layer with good ductility and excellent physical properties.
– Applicable to both direct current and impulse current.
– Able to reduce copper deposition on board when filling the blind via hole and thus shorten the operating cycle.
– Especially suitable for enhancing the stability of inner board.

MIS VF-2 Blind Via Hole Acid Copper Plating Process

– Suitable for fine circuit, multi layer circuit board and blind via holes plating processes on HDI printed circuit board (including full board plating and pattern plating).
– Able to form an even, fine, smooth and bright deposit with good appearance.
– The concentration of additives in bath can be tested by Cyclic Voltammetric Stripping (CVS).