PA (Polyamide) Electro-plating Process

PROCLEANER SOAK 151 Hot Dip Cleaning Powder

– Low alkalinity, cause no harm to substrates.
– Excellent emulsifier with great tolerance to oil and dirt.
– Can be used by hot dip washing or operated with ultrasonic for better results.

POP PC-300 Conditioner

– Suitable for hydrophilic cleaning process of plastic workpieces.
– Wide working range; cause no harm to the substrates.
– Free of any smoke and oduor.
– High tolerance to water hardness.
– Environmentally-friendly; easy wastewater treatment.

POP PC-305 Sweller

– Solvent-based.
– Allow the expansion of special polycarbonate resin surface before etching and thus improve the adhesive ability between substrate and electroless deposit.

POP PC-310 Etcher

– Chromic acid-based and sulfuric acid-based.
– Suitable for plastic plating process.
– Able to enhance activation ability of palladium in ABS or ABS/PC plastic plating.
– Reduce the possibility of skip-plating.

POP PC-358 Etching Wetter

– Able to lower the surface tension of the etcher and thus ensure the uniformity of
plastic surface and facilitate the detachment of solution from work pieces.
– Suitable for chromic acid and sulfuric acid in plastic plating process.

POP PC-350 Neutralizer

– Use after etching treatment of plastic plating process to neutralize the remaining etcher
and avoid contamination in the subsequent plating processes.

POP PA-TS Conditioner for Polyamide

– Concentrated formula; easy to use.
– Excellent regulating effect and thus compatible with dilute catalyst.
– Cost-saving.
– Enhance adhesive ability between base substrate and nickel or copper deposit.

PA-AR Activator for Polyamide Plating Process

– Acid-based; especially designed for polyamide surface.
– Applicable to non-catalytic surface before POP PA-E nickel plating
process.
– Able to deposit a metal film on substrate after reduction procedure.
– Facilitate the formation of a finegrained and compact deposit with excellent adhesive ability in the subsequent nickel plating process.

POP PA-RT Reducer for Polyamide Plating Process

– Advanced reduction procedure for non-conductive subtrates like polyamide.
– Able to form an deposit with excellent resisitance to acid without changing the surface structure and thus enhance the adhesive ability between substrate and deposit.
– Can prevent the surface from oxidation during the subsequent operation cycles.

ENCHEM™ PA-E Low Phosphorus Electroless Nickel Plating Process for Polyamide

– Low electrical resistance.
– Low phosphorus content.
– Excellent abrasion resistance.
– High stability; long bath life.
– Wide range of operating pH value and temperature.
– Only single component is needed to intiate makeup procedure.

SPECTRA™ T-400 Nickel Strike Plating Process

– Specially designed for workpieces which require high anti-corrosion
ability.
– Able to form a semi-bright nickel deposit for double-layer or multilayer nickel system.
– Adopt coumarin-free additive and thus lower the cost of wastewater treatment and activated carbon
treatment.
– Excellent levelling power and good ductility; potential difference (S.T.E.P.) is compatible with systems with coumarin.
– Easy to control.

SPECTRA™ T-500 Nickel Strike Plating Process

– Specially designed for workpieces which require high anti-corrosion
ability.
– Able to form a semi-bright nickel deposit for double-layer or multilayer nickel system.
– Adopt coumarin-free additive and thus lower the cost of wastewater treatment and activated carbon treatment.
– Excellent levelling power and good ductility; potential difference (S.T.E.P.) is compatible with systems with coumarin.
– Easy to control.

ÜBER-BRITE™ X Bright Acid Copper Plating Process (Ultra-concentrated)

– Concentrated formula; excellent levelling power can reach up to
95%.
– High stability; easy bath control.
– Pinholes are not easily formed; good tensile stress and outstanding
ductility.
– Able to form a clear and bright deposit; can eliminate fogging.
– High tolerance to impurities; extremely long bath life.
– Rapid levelling at low current density area; even thickness at high and low current density areas.
– Especially suitable for automotive industry such as, aluminium wheel, plastic plating and metal workpiece.

SPECTRA™ T-550 Semi-Bright Nickel Plating Process

– Specially designed for work pieces which require high anti-corrosion ability.
– Able to form a semi-bright nickel deposit for double-layer or multilayer nickel system.
– Adopt coumarin-free additive and thus lower the cost of wastewater treatment and activated carbon treatment.
– Excellent levelling power and good ductility; potential difference (S.T.E.P.) is compatible with systems with coumarin.
– Easy to control.

SPECTRA™ T-562 Semi-Bright Nickel Plating Process

– Specially designed for work pieces which require high anti-corrosion
ability.
– Able to form a semi-bright nickel deposit for double-layer or multilayer
nickel system.
– Adopt coumarin-free additive and thus lower the cost of wastewater treatment and activated carbon treatment.
– Excellent levelling power and good ductility; potential difference (S.T.E.P.) is compatible with systems with coumarin.
– Easy to control.

SPECTRA™ K-600 High Sulfur Nickel Additive Plating Process

– Specially designed for multilayer nickel plating processes which require high anti-corrosion
ability.
– Increase the nickel content of nickel deposit to 0.1-0.2 %.
– Place between semi-bright nickel layer (low nickel content) and bright nickel layer to increase the potential difference and thus enhance the anti-corrosion ability.

NALDO™ R-88 Bright Nickel Plating Process

– Rapid brightening and levelling.
– Able to form an even nickel deposit within a wide range of current density.
– Excellent ductility and good coverage at low current density area.
– Simplify chrome plating process; very few by-products formed and long bath life.
– Single additive system; suitable for single-layer bright nickel plating or multi-layer nickel plating with high anti-corrosion requirement.

NIKO™ R-328 Bright Nickel Plating Process

– Rapid brightening and levelling.
– Able to form a bright, even and white nickel deposit within a wide range of current density.
– Excellent ductility and good coverage at low current density area.
– Simplify the chrome plating process; very few by-products formed and long bath life.
– Suitable for single-layer bright nickel plating or multi-layer nickel plating with high anti-corrosion requirement.

NIKO™ R-99 Bright Nickel Plating Process

– Rapid brightening and levelling.
– Able to form an even nickel deposit within a wide range of current density.
– Simplify chrome plating process; very few by-products formed and long bath life.
– Suitable for single-layer bright nickel plating or multi-layer nickel plating with high anti-corrosion requirement.

SPECTRA™ T-700 Nickel Sealing Process

– Especially suitable for multi-layer nickel plating with high anti-corrosion requirement.
– Contain non-conductive micro particles which evenly distributed on the bright nickel deposit (9300- 20000 micropores/cm).
– Enable micropores to be formed on chromium surface layer and thus enhance its anti-corrosion ability

SPECTRA™ T-720 Nickel Sealing Process

– Able to form a thin and bright nickel deposit from flash plating.
– Enable micropores to be formed on the surface layer and thus increase the anti-corrosion ability of the multi-layers.
– Perform best when applying to multi-layer nickel deposits and deposits without pinholes.

CR-A, CR-B Hexavalent Chromium Plating Process

– Excellent throwing power and dispering power.
– Cost-saving; able to operate at a relatively low temperature and current density.
– Can reach 8 cm Hull Cell test.
– Contain sulfuric acid.

CHROMO-TRI™ V Trivalent Chromium White Plating Process (Chloride-based)

– Enviromentally-friendly.
– Easy wastewater treatment; free of hexavalent chromium and thus no chromium mist eliminator is needed.
– Excellent covering power and throwing power.
– Able to operate under current interruption without affecting product quality; have a faster
deposition rate than hexavalent chromium plating.

CHROMO-TRI™ VB Trivalent Chromium Black Plating Process (Chloride-based)

– Environmentally-friendly; comply with the RoHS standard.
– Able to form a deposit with attractive black appearance, great hardness, excellent abrasion resistance and corrosion resistance.
– The metallic chromium is derived from the trivalent chromium compounds.
– Low metallic chromium content.
– Free of hexavalent Chromium; simple wastewater treatment.
– Outstanding results in neutral salt spray test, artificial sweat test and abrasion resistance test etc.

CHROMO-TRI™ ES Trivalent Chromium White Plating Process (Sulfate-based)

– Free of hexavalent chromium, which is a carcinogen, and thus enhance the safety of operation.
– Excellent covering and throwing power; low metal concentration and thus simplify wastewater treatment.
– High capability of current flow and thus minimize the power consumption.
– High tolerance to metal impurities; ion-exchange is unnecessary for removing the
impurities and therefore reduce the operating cost.

CHROMO-TRI™ S Trivalent Chromium White Plating Process (Sulfate-based)

– Free of hexavalent chromium and thus simplify the wastewater treatment.
– Able to form a whiter and brighter deopsit with faster deposition rate and wider operating application than hexavalent chromium plating.
– Can fulfill the friction coefficient requirements of conventional or nickel plating system.
– Excellent covering and levelling power.
– High tolerence to current interruption; good anti-corrosion ability

CHROMO-TRI™ B Trivalent Chromium Black Plating Process (Sulfate-based)

– Able to form an attractive bright black decorative deposit.
– Applicable to general chromium plating on nickel deposit.
– Possess all the advantages of trivalent chromium plating process.