Moulded Interconnect Device (MID) for Laser Direct Structuring (LDS) Process

PROCLEANER SOAK 151 Hot Dip Cleaning Powder

– Low alkalinity, cause no harm to substrates.
– Excellent emulsifier with great tolerance to oil and dirt.
– Can be used by hot dip washing or operated with ultrasonic for better results.

POP-PLUS MIDs AD-457 Activator

– Activation process of electroplating.
– Applicable to ABS and PC, PBT and PET, SPS and PPS, polyamide and fiber glass.
– Easy to control; reduce the possibilities of skip-plating and excessive plating.

POP-PLUS MIDs RA-200 Reducer

– Reduction process of electroless plating.
– Applicable to ABS and PC, PBT and PET, SPS and PPS, polyamide and fiber glass.
– Easy to control; reduce the possibilities of skip-plating and excessive plating.

POP-PLUS MIDs PPC-460 Electroless Copper Plating Process

-High speed and moderate operating temperature.
– Able to form a bright, fine and even conductive layer through chemical
deposition during MID workpieces production.
– Easy operation; long bath life.
– Wide operating range; different concentration of additives and stabilizers can reach various production requirements.

POP-PLUS MIDs PPC-470 Electroless Copper Plating Process

– High speed and moderate operating temperature.
– Able to form a bright, fine and even conductive layer through chemical deposition during MID workpieces production.
– Easy operation; long bath life.
– Wide operating range; different concentration of additives and stabilizers can reach various production requirements.

POP-PLUS MIDs PPC-530 Electroless Copper Plating Process

– High stability, excellent activating power and speedy initiation.
– Moderate speed; able to form a bright, fine and uniform conductive layer through chemical deposition during MID workpieces production.
– The layer formed is delicate and fine and thus able to ensure good smoothness and avoid problems like skip plating and excessive plating.
– Perform well in MID production, especially in the last procedure of LDS.
– No pre-activation is needed and thus enhance the operation efficiency.
– Easy operation; long bath life.
– Different concentration of additives and stabilizers can reach various
production requirements.

POP-PLUS MIDs AD-440 Micro-etching Process for Copper Surface

– Able to form a non-complexing etching working solution after mixing with water and sulfuric acid.
– React on both copper and copper alloy.
– Able to create a bright, clean and even etching effect on copper surface.
– Excellent micro-etching depth and solderability.

POP-PLUS MIDs AD-453 Copper Surface Activator for Pre-nickel plating

– Acid-based; activate copper surface before electroless nickel plating process.
– Able to form a bright, smooth coating with excellent solderability.

POP-PLUS MIDs ENCHEM L-560 Low Temperature Low Phosphorus Electroless Nickel
Plating Process

– Specially designed for plastic plating.
– Able to form an even nickel-phosphorus alloy deposit on electroless copper substrates for MID and EMI/RFI shielding applications, especially suitable for ABS/PC substrates.
–  Able to prevent copper layer from oxidation and provide the best shielding performance.

ENCHEM™ M7-R Middle Phosphorus Electroless Nickel Plating Process

– Able to form a uniform semibright or bright nickel deposit with uniform brightness and stable plating speed.
– Good stability in high temperature operation.
– Can be an ultimate surface layer to prevent discoloration and oxidation after electroless copper plating or a protective layer to prevent diffusion.

CIRCUM-BRITE™ 806 Electroless Nickel Immersion Gold (ENIG) Plating Process

– Able to form a smooth and delicate 24K aurum layer on nickel alloy deposit.
– Able to show the primary brightness of the substrate.
– Replenishable bath; cost-saving.

NALDO™ SSS Nickel Sealer

– Possess a great adhesion power to metal surface and plated layer, especially on nickel layer.
– Form a solid alkaline layer after curing. It is transparent, bright, wearable, water-insoluble and acid-resistant.
– The layer can also resist fingerprints, heat, moisture, acidity, alkalinity and high temperature.
–  Able to fufill the requirements of anit-corrosion and anti-discoloration of deposit layers.
– Easy operation; widely used by 3D-MID industry.

NALDO™ Nickel Sealer

– Possess a great adhesion power to metal surface and plated layer, especially on nickel layer.
– Form a solid alkaline layer after curing. It is transparent, bright, wearable, water-insoluble and acid-resistant.
– The layer can also resist fingerprints, heat, moisture, acidity, alkalinity and high temperature.
– Applicable to the post-treatment  of the deposits of zinc, zinc
nickel alloy, replica gold or those with passivation films and able to enhance their anti-corrosion abilities and attractiveness.