Mobile Phone/Electronics (Nickel-free) Plating Process

PROCLEANER BCR Multi-purpose Wax Remover

– Neutral pH solution, harmless to subtrates and keep the original sheen of the surface of the
polished surface.
– Excellent emulsifier with rapid wax cleaning speed.
– Use with ultrasonic washing for better results.

POP PC-300 Conditioner

– Suitable for hydrophilic cleaning process of plastic workpieces.
– Wide working range; harmless to the substrates.
– Free of any smoke and oduor; high tolerance to water hardness.

POP PC-305 Sweller

– Solvent-based.
– Allow the expansion of special polycarbonate resin surface before etching and thus improve
the adhesive ability between substrate and electroless deposit.

POP PC-320 Sweller

– Allow the expansion of PC or PC/ABS plastic substrates before etching and thus enhance
their adhesive abilities.
– Able to pass Cold and Hot water Cycling test.
– Especially suitable for automotive, computer and sanitary industries.

POP PC-310 Etcher

– Chromic acid-based and sulfuric acid-based.
– Suitable for plastic plating process.
– Able to enhance activation ability of palladium in ABS or ABS/PC plastic plating.
– Reduce the possibility of skip-plating.

POP PC-358 Etching Wetter

– Able to lower the surface tension of the etcher and thus ensure the uniformity of plastic surface
and facilitate the detachment of solution from work pieces.
– Suitable for chromic acid and sulfuric acid in plastic plating process.

POP PC-350 Neutralizer

– Uses after etching treatment of ABS plastic plating process. It effectively neutralizes remaining solution after etching.

POP PC-450 Activator

– Tin-palladium activating solution.
– Excellent activiating power.
– Able to form a palladium deposit on ABS or PC surface after etching process.
– Especially suitable for the copper reduction processes of plastic plating or general plastic plating processes.

POP PC-480 Activator

– Tin-palladium activating solution.
– Able to form a palladium deposit on ABS or PC surface after etching process.

POP PC-375 Accelerator

– Use after the palladium deposition process of plastic plating.
– Able to reduce palladium usage up to 33%.
– Wide operating range; long lifespan.
– Corrosive.

POP PC-385 Accelerator

– Fluoride-free; can effectively remove the excessive tin on plastic surface and thus enhance its activating power.
– High tolerance to metal impurities.
– Suitable for all kinds of plastic substrate, applicable to both rack plating and barrel plating.
– Chloride-based.

POP-PLUS MIDs PPC-460 Electroless Copper Plating Process

– High speed and moderate operating temperature.
– Able to form a bright, fine and even conductive layer through chemical deposition during MID workpieces production.
– Easy operation; long bath life.
– Wide operating range; different concentration of additives and stabilizers can reach various
production requirements.

POP-PLUS MIDs PPC-470 Electroless Copper Plating Process

– High speed and moderate operating temperature.
– Able to form a bright, fine and even conductive layer through chemical deposition during MID workpieces production.
– Easy operation; long bath life.
– Wide operating range; different concentration of additives and stabilizers can reach various production requirements.

UBER-BRITE™ X Bright Acid Copper Plating (Ultra-concentrated)

– Concentrated formula; excellent levelling power can reach up to 95%.
– High stability; easy bath control.
– Pinholes are not easily formed; good tensile stress and outstanding ductility.
– Able to form a clear and bright deposit; can eliminate fogging..
– High tolerance to impurities; extremely long bath life.
– Rapid levelling at low current density area; even thickness at high and low current density
areas.
– Especially suitable for automotive industry such as, aluminium wheel, plastic plating and metal workpiece.

TINOL NF-65 High Speed Lead-free White Bronze Barrel Plating Process

– Able to form a bright white deposit which can be the surface of the parts or the base layer of the palladium plating and the gold plating.
– Suitable for barrel plating.
– Lead-free; comply with the OKOTEK requirement.

TINOL NF-67 Lead-free White Bronze Rack Plating Process

– Able to form a bright white deposit which can be the surface of the parts or the base layer of the palladium plating and the gold plating.
– Suitable for rack plating.
– Do not induce any allegic reaction caused by nickel deposit.
– Excellent corrosion and abrasion resistance, good solderability and low friction coefficient.
– Can be an alternative to nickel plating process for decorative and electronics plating.

TINOL NF-69 White Bronze Plating Process

– Able to form a bright silvery white deposit with good anti-corrosion ability.
– Suitable as the base layer of aurum plating.
– The layer hardness is 300-400 HV and the weight is only 0.82-0.85 μg/μm.
– Only require 1.4 min (1.5 ASD) to deposit 1μm.

TCGB-B Black Tin/Cobalt Alloy Plating Process

– Able to form a tin nickel deposit with attrative black appearance.
– Use after bright nickel or matte nickel plating processes to create a special aesthetic effect.
– Excelling covering power; suitable for barrel plating.
– Easy handling, able to overcome the typical problems of alloy platings.

TCGB-G Gray Tin/Cobalt Alloy Plating Process

– Especially suitable for plating for decorative purpose.
– Able to form a tin cobalt deposit with attractive grey black appearance.
– Use after bright nickel or matte nickel plating processes to create a special aesthetic effect.

TNGB Black Tin/Nickel Alloy Plating Process

– Able to form a tin nickel deposit with attractive black appearance, high stability and uniform color surface.
– Enhance the anti-corrosion performance of the deposit.
– Excelling covering power; suitable for barrel plating.
– Great anti-abrasion and antioxidization abilities and thus no extra protective coating is needed.

CHROMO-TRI™ V Trivalent Chromium White Plating Process (Chloride-based)

– Enviromentally-friendly.
– Easy wastewater treatment; free of hexavalent chromium and thus no chromium mist eliminator is needed.
– Excellent covering power and throwing power.
– Able to operate under current interruption without affecting product quality; have a faster deposition rate than hexavalent chromium plating.

CHROMO-TRI™ VB Trivalent Chromium Black Plating Process (Chloride-based)

– Environmentally-friendly; comply with the RoHS standard.
– Able to form a deposit with attractive black appearance, great hardness, excellent abrasion resistance and corrosion resistance.
– The metallic chromium is derived from the trivalent chromium compounds.
– Low metallic chromium content.
– Free of hexavalent Chromium; simple wastewater treatment.
– Outstanding results in neutral salt spray test, artificial sweat test and abrasion resistance test etc.

CHROMO-TRI™ ES Trivalent Chromium White Plating Process (Sulfate-based)

-Free of hexavalent chromium, which is a carcinogen, and thus enhance the safety of operation.
– Excellent covering and throwing power; low metal concentration and thus simplify wastewater treatment.
– High capability of current flow and thus minimize the power consumption.
– High tolerance to metal impurities; ion-exchange is unnecessary for removing the impurities and therefore reduce the operating cost.

CHROMO-TRI™ S Trivalent Chromium White Plating Process (Sulfate-based)

– Free of hexavalent chromium and thus simplify the wastewater treatment.
– Able to form a whiter and brighter deopsit with faster deposition rate and wider operating application than hexavalent chromium plating.
– Can fulfill the friction coefficient requirements of conventional or nickel plating system.
– Excellent covering and levelling power.
– High tolerence to current interruption; good anti-corrosion ability.

CHROMO-TRI™ B Trivalent Chromium Black Plating Process (Sulfate-based)

– Able to form an attractive bright black decorative deposit.
– Applicable to general chromium plating on nickel deposit.
– Possess all the advantages of trivalent chromium plating process.