EMI Shielding (for Notebook Computer) Plating Process

PROCLEANER SOAK 151 Hot Dip Cleaning Powder

– Low alkalinity, cause no harm to substrates.
– Excellent emulsifier with great tolerance to oil and dirt.
– Can be used by hot dip washing or operated with ultrasonic for better results.

POP-PLUS MIDs PPC-460 Electroless Copper Plating Process

– High speed and moderate operaing temperature.
– Able to form a bright, fine and even conductive layer through chemical deposition during MID workpieces production.
– Easy operation; long bath life.
– Wide operating range; different concentration of additives and stabilizers can reach various
production requirements.

POP-PLUS MIDs PPC-470 Electroless Copper Plating Process

– High speed and moderate operating temperature.
– Able to form a bright, fine and even conductive layer through chemical deposition during MID workpieces production.
– Easy operation; long bath life.
– Wide operating range; different concentration of additives and stabilizers can reach various production requirements.

POP-PLUS MIDs PPC-530 Electroless Copper Plating Process

– High stability, excellent activating power and speedy initiation.
– Moderate speed; able to form a bright, fine and uniform conductive layer through chemical deposition during
MID workpieces production.
– The layer formed is delicate and fine and thus able to ensure good smoothness and avoid problems like skip plating and excessive plating.
– Perform well in MID production, especially in the last procedure of LDS.
– No pre-activation is needed and thus enhance the operation efficiency.
– Easy operation; long bath life.
– Different concentration of additives and stabilizers can reach various production requirements.

POP-PLUS MIDs AD-440 Micro-etching Process for Copper Surface

– Able to form a non-complexing etching working solution after mixing with water and sulfuric acid.
– React on both copper and copper alloy.
– Able to create a bright, clean and even etching effect on copper surface.
– Excellent micro-etching depth and solderability.

POP-PLUS MIDs AD-453 Copper Surface Activator for Pre-nickel Plating

– Acid-based; activate copper surface before electroless nickel plating process.
– Able to form a bright, smooth coating with excellent solderability.

POP-PLUS MIDs ENCHEM L-560 Low Temperature Low Phosphorus Electroless Nickel Plating Process

– Specially designed for plastic plating.
– Able to form an even nickel-phosphorus alloy deposit on electroless copper substrates
for MID and EMI/RFI shielding applications, especially suitable for ABS/PC substrates.
– Able to prevent copper layer from oxidation and provide the best shielding performance.

ENCHEM™ M7-R Middle Phosphorus Electroless Nickel Plating Process

– Able to form a uniform semi-bright or bright nickel deposit with uniform
brightness and stable plating speed.
–  Good stability in high temperature operation.
– Can be an ultimate surface layer to prevent discoloration and oxidation after electroless copper plating or a protective layer to prevent diffusion.