ABS and ABS/PC Plastic Plating Process

PROCLEANER BCR Multi-purpose Wax Remover

– Neutral pH solution, harmless to subtrates and keep the original sheen of the surface
of the polished surface.
– Excellent emulsifier with rapid wax cleaning speed.
– Use with ultrasonic washing for better results.

POP PC-300 Conditioner

– Neutral pH solution, harmless to subtrates and keep the original sheen of the surface
of the polished surface.
– Excellent emulsifier with rapid wax cleaning speed.
– Use with ultrasonic washing for better results.

POP PC-305 Sweller

– Solvent-based.
– Allow the expansion of special polycarbonate resin surface before etching and thus improve the adhesive ability  between substrate and electroless deposit.

POP PC-310 Etcher

– Chromic acid-based and sulfuric acidbased.
– Suitable for plastic plating process.
– Able to enhance activation ability of palladium in ABS or ABS/PC plastic plating.
– Reduce the possibility of skip-plating.

POP PC-358 Etching Wetter

– Able to lower the surface tension of the etcher and thus ensure the uniformity of
plastic surface and facilitate the detachment of solution from work pieces.
– Suitable for chromic acid and sulfuric acid in plastic plating process.

POP PC-350 Neutralizer

– Uses after etching treatment of ABS plastic plating process. It effectively neutralizes
remaining solution after etching.

POP PC-450 Activator

– Tin-palladium activating solution.
– Excellent activiating power.
– Able to form a palladium deposit on ABS or PC surface after etching process.
– Especially suitable for the copper reduction processes of plastic plating or general plastic plating processes.

POP PC-480 Activator

– Tin-palladium activating solution.
– Able to form a palladium deposit on ABS or PC surface after etching process.

POP PC-375 Accelerator

– Use after the palladium deposition process of plastic plating.
– Able to reduce palladium usage up to 33%.
– Wide operating range; long lifespan.
– Corrosive.

POP PC-385 Accelerator

– Fluoride-free; can effectively remove the excessive tin on plastic surface and thus enhance its activating power.
– High tolerance to metal impurities.
– Suitable for all kinds of plastic substrate, applicable to both rack plating and barrel plating.
– Chloride-based.

PM91 Electroless Nickel Plating Process

– Able to form a smooth and continuous deposit with good adhesive power on activated plastic surface.
– High stability; low working temperature and thus lower the operating cost.
– Execellent anti-sintering ability.
– Applicable to both rack plating and barrel plating.
– After PM91 plating process, a flash copper plating or flash nickel plating is recommended before bright acid copper plating.

PPC Electroless Copper Plating Process

– Different from copper pyrophosphate process, this process can effectively reduce the
energy comsuption by omitting the neutralization process between electroless nickel plating and acid copper plating.
– Have a much lower chloride ion content than Watts nickel plating and thus will not affect acid copper plating process even when accidentally added into copper sulfate bath.
– Excellent adhesive power between electroless nickel deposit and acid copper deposit.
– Free of any toxic content or chelate agent; easy wastewater treatment.

R.S.751 Pyrophosphate Copper Plating Process

– Easy operation; high brightness.
– Low consumption rate for brightener, wide application range, and easy to control.
– Able to form a mirror-bright and smooth deposit with good covering power and excellent
ductility.
– Current efficiency can reach up to 100 %; excellent adhesive power.
– Higher operation efficiency.
– Cause no harm to substrate, especially suitable for zinc alloy workpieces and the pre-plating of plasting plating process.

SPECTRA™ T-400 Nickel Strike Plating Process

– Specially designed for work pieces which require high anti-corrosion ability.
– Able to form a semi-bright nickel deposit for double-layer or multilayer nickel system.
– Adopt coumarin-free additive and thus lower the cost of wastewater treatment and activated carbon treatment.
– Excellent levelling power and good ductility; potential difference (S.T.E.P.) is compatible with systems with coumarin.
-Easy to control.

SPECTRA™ T-500 Nickel Strike Plating Process

– Specially designed for work pieces which require high anti-corrosion ability.
– Able to form a semi-bright nickel deposit for double-layer or multilayer nickel system.
– Adopt coumarin-free additive and thus lower the cost of wastewater treatment and activated carbon treatment.
– Excellent levelling power and good ductility; potential difference (S.T.E.P.) is compatible with systems with coumarin.
– Easy to control.

ÜBER-BRITE™ X Bright Acid Copper Plating Process (Ultra-concentrated)

– Concentrated formula; excellent levelling power can reach up to 95%.
– High stability; easy bath control.
– Pinholes are not easily formed; good tensile stress and outstanding ductility.
– Able to form a clear and bright deposit; can eliminate fogging.
– High tolerance to impurities; extremely long bath life.
– Rapid levelling at low current density area; even thickness at high and low current density areas.
– Especiall suitable for automotive industry such as, aluminium wheel, plastic plating and metal workpiece.

SPECTRA™ T-550 Semi-bright Nickel Plating Process

– Specially designed for work pieces which require high anti-corrosion ability.
– Able to form a semi-bright nickel deposit for double-layer or multilayer nickel system.
– Adopt coumarin-free additive and thus lower the cost of wastewater treatment and activated carbon treatment.
– Excellent levelling power and good ductility; potential difference (S.T.E.P.) is compatible with systems with coumarin.
– Easy to control.

SPECTRA™ T-562 Semi-Bright Nickel Plating Process

– Specially designed for work pieces which require high anti-corrosion ability.
– Able to form a semi-bright nickel deposit for double-layer or multilayer nickel system.
– Adopt coumarin-free additive and thus lower the cost of wastewater treatment and activated carbon treatment.
– Excellent levelling power and good ductility; potential difference (S.T.E.P.) is compatible with systems with coumarin.
– Easy to control.

SPECTRA™ K-600 High Sulfur Nickel Additive Plating Process

– Specially designed for multilayer nickel plating processes which require high anti-corrosion
ability.
– Increase the nickel content of nickel deposit to 0.1-0.2 %.
– Place between semi-bright nickel layer (low nickel content) and bright nickel layer to increase the potential difference and thus enhance the anti-corrosion ability.

NALDO™ R-88 Bright Nickel Plating Process

– Rapid brightening and levelling.
– Able to form an even nickel deposit within a wide range of current density.
– Excellent ductility and good coverage at low current density area.
– Simplify chrome plating process; very few by-products formed and long bath life.
– Single additive system; suitable for single-layer bright nickel plating or multi-layer nickel plating with high anti-corrosion requirement.

NUMAT VEX-1 Pearl Nickel Plating Process

– Able to form an attractive decorative deposit with high brightness, excellent ductity, great hardness and anti-fingerprints ability.
– Can be covered with different metal layers to create different decorative functions.
– Easy operation; black and light spots are not easily formed.
– Good throwing power and thus can be operated under a wide range of current density.
– Suitable for any substrate, such as steel, copper and zinc alloy.
– Easy replenishment, suitable for manual or automatic production system

NUMAT VEX-6 Pearl Nickel Plating Process

– Able to form a uniform metallic pearl nickel deposit by rack plating.
– Can be operated under a wide range of current density.
– Suitable for any substrate such as steel, copper and zinc alloy.
– Easy for chromate plating; fingerprints are not easily formed on the layer.
– Easy replenishment, suitable for manual or automatic production system.

NUMAT VEX-100 Pearl Nickel Plating Process

– Able to form a delicate, even, finegrained, metallic and matte white deposit with three-dimenisional appearance, anti-fingerprints ability and excellent levelling power.
– High efficiency; short plating time.
– High stablility and thus no daily makeup, filtration and production is needed for 15-30 working days without affecting the layer appearance.
– Easy to control; black and light spots are not easily formed.
– High surface activation, easy for chromate plating, low decomposition and long working hours.
– Water-based formula and thus no grease will be formed during operation.
– Suitable for processes like high grade metal and plastic plating, such as, house wares, sanitary wares, electrical appliances, mobile phone and computer.
– Appearance can be adjusted easily by using different matting agents.

SPECTRA™ T-700 Nickel Sealing Process

– Especially suitable for multilayer nickel plating with high anti-corrosion requirement.
– Contain non-conductive micro particles which evenly distributed on the bright nickel deposit (9300-20000 micropores/cm).
– Enable micropores to be formed on chromium surface layer and thus enhance its anti-corrosion ability.

SPECTRA™ T-720 Nickel Sealing Process

– Able to form a thin and bright nickel deposit from flash
plating.
– Enable micropores to be formed on the surface layer and thus increase the
anti-corrosion ability of the  multi-layers.
– Perform best when applying to multi-layer nickel deposits and deposits without pinholes.

CR-A, CR-B Hexavalent Chromium Plating Process

– Excellent throwing power and dispering power.
– Cost-saving; able to operate at a relatively low temperature and current
density.
– Can reach 8 cm Hull Cell test.
– Contain sulfuric acid.

CHROMO-TRI™ V Trivalent Chromium White Plating Process (Chloride-based)

– Enviromentally-friendly.
– Easy wastewater treatment; free of hexavalent chromium and thus no chromium mist eliminator is needed.
– Excellent covering power and throwing power.
– Able to operate under current interruption without affecting product quality; have a faster deposition rate than hexavalent chromium plating.

CHROMO-TRI™ VB Trivalent Chromium Black Plating Process (Chloride-based)

– Environmentally-friendly; comply with the RoHS standard.
– Able to form a deposit with attractive black appearance, great hardness,
excellent abrasion resistance and corrosion resistance.
– The metallic chromium is derived from the trivalent chromium compounds.
– Low metallic chromium content.
– Free of hexavalent Chromium; simple wastewater treatment.
– Outstanding results in neutral salt spray test, artificial sweat test and abrasion resistance test etc.

CHROMO-TRI™ ES Trivalent Chromium White Plating Process (Sulfate-based)

– Free of hexavalent chromium, which is a carcinogen, and thus enhance the safety of operation.
– Excellent covering and throwing power; low metal concentration and thus simplify wastewater treatment.
– High capability of current flow and thus minimize the power consumption.
– High tolerance to metal impurities; ion-exchange is unnecessary for removing the impurities and therefore reduce the operating cost.

CHROMO-TRI™ S Trivalent Chromium White Plating Process (Sulfate-based)

-Free of hexavalent chromium and thus simplify the wastewater treatment.
– Able to form a whiter and brighter deopsit with faster deposition rate and wider operating application than hexavalent chromium plating.
– Can fulfill the friction coefficient requirements of conventional or nickel plating system.
– Excellent covering and levelling power.
– High tolerence to current interruption; good anti-corrosion ability.

CHROMO-TRI™ B Trivalent Chromium Black Plating Process (Sulfate-based)

– Able to form an attractive bright black decorative deposit.
– Applicable to general chromium plating on nickel deposit.
– Possess all the advantages of trivalent chromium plating process.

PALDO™ V-100 Chromium Mist Eliminator

– Permanently stable and highly effective wetter, suitable for all chromium plating baths.
– Can effectively prevent the emission of chromic acid mist and noxious fumes.
– Can also be used in other acid, alkaline or electrolytic plating baths.
– Low consumption, cost-saving.

PALDO™ V-200 Chromium Mist Eliminator

– Fluoride-type surfactant.
– Have good performance in eliminating chromium mist.
– Can also be used in other acid, alkaline or electrolytic plating baths.
– Low consumption, cost-saving.

PALDO™ V-300 Chromium Mist Eliminator

– Fluoride-type surfactant.
– Have good performance in eliminating chromium mist.
– Can also be used in other acid, alkaline or electrolytic plating baths.
– Low consumption, cost-saving

PALDO™ V-500 Chromium Mist Eliminator (Concentrated)

– Fluoride-type surfactant.
– Have good performance in eliminating chromium mist.
– Can also be used in other acid, alkaline or electrolytic plating baths.
– Low consumption, cost-saving.