Middle Phosphorus Electroless Nickel Plating Process

ENCHEM™ M7-R Middle Phosphorus Electroless Nickel Plating Process

– Form a semi-bright or bright nickel deposit with uniform brightness under stable deposition rate.
– Provide good stability with high-temperature resistance.
– Can be the ultimate surface layer to prevent discoloring and oxidation of the copper layer or the protective layer to prevent diffusion

ENCHEM
M9-AM
Middle Phosphorus (Cd/Pd-free) Electroless Nickel Plating Process (AM)

– Unique stabilizer or complexor helps to prolong the bath life (16 MTO);
– Easy operation and high deposition rate.
– Suitable for both barrel and rack plating.
– Applicable to middle or high phosphorus plating system.
– Can be used for catering and medical equipment application.
– Good adhesive ability on various metal subtrates and strong tolerance to metal impurities.
– Excellent corrosion resistance and good ductility.
– Additive is easily control and cost-effective.

ENCHEM M9-PO Middle Phosphorus (Cd/Pd-free) Electroless Nickel Plating Process (PO)

– Unique stabilizer or complexor helps to prolong the bath life (16 MTO).
– Easy operation and high deposition rate.
– Suitable for both barrel and rack plating.
– Applicable to middle or high phosphorus plating system.
– Can be used for catering and medical equipment application.
– Good adhesive ability on various metal subtrates and strong tolerance to metal impurities.
– Excellent corrosion resistance and good ductility.
– Additive is easily control and cost-effective.