Tin Plating Process

STANNOMAX™ HSB-100 High Speed Pure Bright Tin Plating Process

– Especially designed for electronic components plating.
– Able to form a bright pure tin deposit with low organic content, excellent solderability, high stability and even thickness.
– Wide operating range.

STANNOMAX™ HSB-300 High Speed Methanesulfonic Acid Bright Tin Plating Process

– Form a pure bright tin deposit with good solderability and low organic composition which applicable to electronic devices components.
– Able to operate within a wide range of operating temperature and thus able to form an even deposit with high stability.
– Perform well in tin soldering, tin dissolution and anti-discoloration tests under high temperature.
– Can operate under high current density; fulfill the testing standards of electronic industry during high speed continuous electroplating process.

STANNOMAX™ SB-300L Low Speed Methanesulfonic Acid Bright Tin Plating Process

– Form a pure bright tin deposit with good solderability and low organic composition which applicable to electronic devices components.
– Perform well in tin soldering, tin dissolution and anti-discoloration tests under high temperature.
– Able to operate within a wide range of operating temperature and thus able to form an even deposit with high stability.
– Can operate under high current density; fulfill the testing standards of electronic industry during high speed continuous electroplating process.

STANNOMAX™ TB Sulfate-based Bright Acid Tin Plating Process

– Able to form a sulfate-based tin deposit with excellent brightness, good ductility and outstanding solderability ASTM B678-86).
– Suitable for both rack plating, barrel plating and high speed plating.
– Can be an alternative to lead-free plating process for corrosion resistance.
– Cost saving; have a wider operating range and require less brightener for both makeup and replenishment compared with the conventional acid copper plating processes.
– Stable bath, able to control the parameter by changing the compositions.

STANNUM™ B-60 Bright Acid Tin Plating Process

– Wide current density range.
– Full bright deposit.
– Low tin content; economical for sulfated based system.
– Single replenishment, stable solution, easy to operate.
– Excellent tin solderability.

STANNOMAX™ HSM-100 High Speed Pure Matte Tin Plating Process

– Reflow tin plating process; specially designed for medium or high speed plating.
– Able to form a pure tin deposit with strong covering power, good ductility, low organic content and excellent solderability.
– Suitable for terminal plating and wire and circuit plating.
– Form an even and stable surface layer and thus suitable for lead-free lower whisker finishing.
– Comply with the electronic industry requirements: MIL-STD-202F, Test Method 208F, J-STD-002 and J-STD-003.

STANNOMAX™ HSM-300 High Speed Pure Matte Tin Plating Process

– Reflow tin plating process; specially designed for medium or high speed plating.
– Able to form a pure tin deposit with strong covering power, good ductility, low organic content and excellent solderability.
– Suitable for terminal plating and wire and circuit plating.
– Form an even and stable surface layer and thus suitable for lead-free lower whisker finishing.
– Comply with the electronic industry requirements: MIL-STD-202F, Test Method 208F, J-STD-002 and J-STD-003.

STANNOMAX™ NT-500 Neutral Tin Barrel Plating Process

– Newly developed product which can help to plate matte tin and tin lead alloy deposit on the terminals of electronic components with pH-sensitive dielectric materials.
– Able to minimize the harm on dielectric areas of electronic components by maintaining the pH at 3.5-4.5.
– Affect the tin ionic coordination in the nearly neutral bath and thus the coupling of small workpieces would be reduced.
– Especially suitable for barrel plating of small workpieces.
– Able to form a smooth and even semi-bright pure tin layer within a very wide current density range.