Silver Plating Process

SILVERMAX™ HS-2 High Speed Silver Plating Process

– Applicable to semiconductor materials, integrated circuits and adapters.
– Able to operate under high current density and thus suitable for mass production.
– Excellent solderability and easy for maintenance.

SILVERMAX™ HS-3 Bright Silver Plating Process

– Able to form a bright silver deposit within high current density range.
– Excellent corrosion resistance performance, comparable the 3KBP of Rohm and Haas standard.
– Transparent bath, easy for monitoring the plating process.

SILVERMAX™ HS-4 LED Silver Plating Process

– Suitable for functional plating for connectors and LED plating.
– High cathode efficiency; able to form a bright silver deposit within high current density range.
– Excellent corrosion resistance performance, comparable to the 3KBP of Rohm and Haas standard.
– Transparent bath, easy for monitoring the plating process.