PALLUMAX Ni Palladium/Nickel Alloy Plating Process
– Specially designed for electronics industry.
– Stable and low contact resistance.
– Excellent flexibility without any cracks.
– Excellent solderability; High hardness and good abrasion resistance.
– 80 % palladium content with highest deposition rate of 25 µm.
– Suitable for both rack and barrel plating.