Copper Plating Process

ÜBER-BRITE™ 210 Bright Acid Copper Plating Process

– Easy bath control; levelling power up to 75% and thus pin holes are not easily formed.
– Low internal stress; high ductility.
– Able to operate within a wide current density range.
– Low resistivity and thus able to fulfill the high physical properties requirement of electronic industry.
– Applicable to various metal substrates such as, copper, zinc alloy and plastic workpieces.
– High tolerance to impurity, carbon activation only needed after long operation.

ÜBER-BRITE™ X Bright Acid Copper Plating Process (Ultra-concentrated)

– Easy bath control; levelling power up to 95% and thus pin holes are not easily formed.
– Low internal stress; high ductility.
– Extremly high stability; able to form a clear and bright coating; fogging problem can be eliminated.
– High tolerance to impurity; long bath life.
– Quick levelling at low current density area, even thickness at high and low current density area, especially suitable for automotive industry (aluminium wheels), plastic plating and conventional metal workpieces.

ÜBER-BRITE™ YP Bright Acid Copper Plating Process (Concentrated)

– Easy bath control; excellent levelling power and thus pin holes are not easily formed.
– Low internal stress; high ductility.
– Extremly high stability; able to form a clear and bright coating; fogging problem can be eliminated.
– High tolerance to impurity; long bath life.
– Quick levelling at low current density area, even thickness at high and low current density area, especially suitable for automotive industry (aluminium wheels), plastic plating and conventional metal workpieces.

ÜBER-BRITE™ ND-100 Bright Acid Copper (Dye-free) Plating Process

– Easy bath control; able to form a deposit with great brightness and thus suitable for LED industry.
– Levelling power up to 85% and thus pin holes are not easily formed.
– Low internal stress; high ductility.
– Able to operate a wide current density range.
– Low resistivity and thus able to fulfill the high physical properties requirement of electronic industry.
– Applicable to various metal substrates such as, copper, zinc alloy and plastic workpieces.
– High tolerance to impurity, carbon activation only needed after long operation.
– Fogging problem can be eliminated and hence suitable for white bronze plating processes.