Pyrophosphate Copper Plating Process

R.S.751 Pyrophosphate Copper Plating Process

– Easy operation; form a bright deposit.
– Low consumption rate of brightener; wide application range and easy management.
– Able to achieve complete mirror-like brightness; excellent covering power.
– High smoothness and flexibility for deposit.
– Current efficiency up to 100%.
– Good adhesive ability and thus reduce operating time and chemical consumption of successive plating process.
– Cause no harm to substrate, especially suitable for pre-plating of zinc alloy die-casting workpieces and plastic plating.