SPECTRA™ T-700 Nickel Sealing Process
– Specially designed for the high anti-corrosion requirement of multi-layer nickel plating process.
– Contain non-conductive micro particles which are evenly distributed on the bright nickel layer (9300-20000 micro pores/cm) and therefore able to form a chromium layer with micro pores and enhance the anti-corrosion ability.
SPECTRA™ T-720 Nickel Sealing Process
-Able to form a thin and bright nickel deposit from flash plating and thus create micro pores on the layer and enhance the anti-corrosion ability of the multi deposit layer.
– Peform best on multi-layer nickel plating process and the layer without pinholes.