Aluminium & Aluminium Alloy Pretreatment

ALUMEX™ DS-1/DS-2 Desmutting Agent for Aluminium Alloy

– Acid-based; designed for mild cleaning of aluminum alloy.
– Have a slower micro-etching speed than alkaline cleaner and thus improve the covering power and adhesive ability of deposits.

ALUMEX™ DS-3 Desmutting Agent for Aluminium Alloy

– Acid-based; designed for mild cleaning of aluminum alloy.
– Have a slower micro-etching speed than alkaline cleaner and thus improve the covering power and adhesive ability of deposits.

ALUMEX™ DC-C Zincates Plating Process for Aluminium and Aluminium Alloy

– Cyanide-based; applicable to the pretreatment of aluminium plating process.
– Able to form a zincate film which contains zinc, copper, iron and nikel on aluminium subtrates.
– The film is even and fine-grained which provides good adhesive performance to the subsequent electroplating.

ALUMEX™ DC-8 Zincates Plating Process for Aluminium Alloy

– Cyanide-based; applicable to the pretreatment of aluminium plating process.
– Able to form a zincate film which contains zinc, copper, iron and nikel on aluminium subtrates.
– The film is even and fine-grained which provides good adhesive performance to the subsequent electroplating.

ALUMEX™ DC-48 Zincates Plating Process for Aluminium Alloy

– Single component chemical.
– Contain four elements (Zn-Ni-Cu-Fe); best suitable for automatic line.
– The micro-etching ability can help to deposit an even and fine-grained zinc layer on aluminium subtrates and provide good adhesive power to the subsequent electroplating.

ALUMEX™ NCB-8 Cyanide-free Electroless Zincates Plating Process for Aluminium Alloy

– Cyanide-free.
– Possess excellent bonding power with aluminium and aluminium alloy.
– Suitable for plating of parts hang on the rack or fill in the basket.
– Easy operation; cost-saving.

ALUMEX™ AL-1000 Electroless Nickel for Aluminium Surface Plating Process

-Flash electroless nickel plating solution.
– Used for pretreatment of electroplating or electroless nickel plating process on aluminium alloy.
– Able to form a very thin, even and active nickel deposit and provide good adhesive power to the subsequent electroless nickel or copper plating process and bright nickel electroplating process.

ALUMEX™ CFP Chromium-free Passivation on Aluminium Substrates

– No extra need of spray coating for anti-corrosion protection after heating and baking.
– Possess excellent bonding power with coating and sealer.
– Free of hexavalent chromium and trivalent chromium.
– Simple operation by spraying or dipping process; no change of electroplating procedure is needed.
– Can directly replace the purfication of nickel salts.