Welcome to visit Winstar’s Booth in SEMICON® China 2018

Winstar actively participates in different exhibitions to exchange our technologies with professionals in the industry every year. This time, it is Winstar’s pleasure to be one of the exhibitors in SEMICON® China 2018 during 14th-16th March in Shanghai.


During the exhibition, Winstar will share the following surface finishing processes:


  • Copper plating process on substrate and wafer
  • Electroless nickel immersion gold process (ENIG)
  • Tin plating process (specially for connection plating)
  • High speed silver plating process for IC industry


Winstar sincerely invites you to come and join us in SEMICON China 2018. The exhibition details are in the following:


Date: 14th-16th March 2017 (Wed-Fri)

Venus: Shanghai New International Expo Centre (SNIEC), 2345 Longyang Road, Pudong New Area, Shanghai, PRC

Booth: 7533, Hall E7

Posted in Uncategorized.

Leave a Reply

Your email address will not be published. Required fields are marked *