SEMICON China 2017, the global largest gathering in semiconductor industries, will be held on 14th-16th March in Shanghai.
To cater to ‘Made-in-China 2025’ strategy of China, Winstar dedicates to delve into different semiconductor plating processes. This time, it is Winstar’s pleasure to be one of the exhibitors to share experiences and techniques with elites from different countries.
Winstar will provide the following technical information:
- Copper plating process on substrate and wafer
- Electroless nickel immersion gold process (ENIG)
- Tin plating process (specially for connection plating)
- High speed silver plating process for IC industry
Winstar sincerely invite you to visit SEMICON China 2017 with the following details:
Date: 14th-16th March 2017 (Tue-Thu)
Venus: Shanghai New International Expo Centre (SNIEC), 2345 Longyang Road, Pudong New Area, Shanghai, P. R. China
Booth: 5346, W5
For more details of SEMICON China 2017, please visit the following website: