11 – 13 May, 2011
Thanks to the kindest support of our honorable guests, we are proud to announce success at SFEXPO 2011, a biennial industry event jointly organized by China Surface Engineering Association Electroplating Branch, Power Coating Institute (USA), Guangdong Electroplating Association, together with the industry associations from Japan, Korea and Singapore as cosponsors.
During the exhibition, we presented our latest development and technologies, including but not limited to MID plating, High anti-corrosion and environmental friendly plating and coating processes.
At the seminar session, our Managing Director, Mr. Nicholas Chang gave a presentation on our latest 3D-MID Metallization Process and exchanged different industry information about this application area.
Meanwhile, we are also pleased to have been awarded by the organizer as “The Best Supplier of Electroplating Materials”.
To conclude, the show was a fruitful experience and it provided us a good chance to meet our prestigious guests and new potential business partners from different parts of the world.