WINSTAR (W.T.C) has started strategic marketing plan for high functional products in Korean market and held a new products business presentation on 11th Nov 2010. It was reported in the January 2011 issue of Monthly Plating and Surface Finishing Journal in Korea after the Journal’s participation.
The Plating Journal is at the moment one of the two most well-known and popular magazine in the industry. It has a history of more than 20 years and holds a fair and neutral position plating business & product trends as well as core market updates.
During the presentation, new product lines such as Moulded Interconnect Device (MID) process, Printed Circuit Broad process, ZICOLLUM™ (Zn-Al powder coating) and new generation of Electroless Nickel process etc. are introduced.
Our ZICOLLUM™ coating system was a special feature in the presentation. It is a unique water based zinc aluminum powder coating with excellent corrosion resistance performance. Treated work pieces could pass SST for maximum 2,000 hours with only low investment required which makes it a considerable replacement for the expensive Zn-Ni alloy plating process.
Another emphasis was Moulded Interconnect Device (MID) process with response to the rapidly growing Smartphone market. Winstar has newly developed a strong electroless copper process and long term electroless nickel process. They are good match to both LDS and TSI process. We are proud to announce with honour in participation in the joint-project together with the leading mobile phone manufacturers in Korea.
For detailed reportage, please click below link: